| MRC | Criteria | Characteristic |
|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 16.89 MILLIMETERS MAXIMUM |
| ABKW | OVERALL HEIGHT | 5.08 MILLIMETERS MAXIMUM |
| ABMK | OVERALL WIDTH | 16.38 MILLIMETERS MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| ALAS | INTERNAL CONFIGURATION | FIELD EFFECT |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-257AB |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE, DRAIN-TO-SOURCE, WITH ALL OTHER TERMINALS SHORT-CIRCUITED TO SOURCE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 43.20 AMPERES MAXIMUM PEAK PULSE CURRENT AND 10.80 AMPERES MAXIMUM DRAIN CURRENT AND 10.80 AMPERES MAXIMUM SOURCE CURRENT |
| CTRD | POWER RATING PER CHARACTERISTIC | 45.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| TEST | TEST DATA DOCUMENT | 82577-H8000218 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 PIN |
